- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/373 - Cooling facilitated by selection of materials for the device
Patent holdings for IPC class H01L 23/373
Total number of patents in this class: 5032
10-year publication summary
|
364
|
450
|
509
|
539
|
590
|
493
|
513
|
481
|
451
|
203
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 43934 |
193 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
186 |
| Fuji Electric Co., Ltd. | 4750 |
171 |
| Intel Corporation | 45621 |
155 |
| Mitsubishi Materials Corporation | 2378 |
110 |
| Infineon Technologies AG | 8189 |
108 |
| Samsung Electronics Co., Ltd. | 131630 |
100 |
| International Business Machines Corporation | 60644 |
98 |
| Denka Company Limited | 2189 |
93 |
| Dexerials Corporation | 1826 |
73 |
| Semiconductor Components Industries, L.L.C. | 5345 |
70 |
| Siemens AG | 24990 |
68 |
| Rohm Co., Ltd. | 5843 |
66 |
| Micron Technology, Inc. | 24960 |
65 |
| Denso Corporation | 23338 |
55 |
| Toshiba Corporation | 12017 |
49 |
| Shin-Etsu Chemical Co., Ltd. | 5132 |
46 |
| Texas Instruments Incorporated | 19376 |
43 |
| Kyocera Corporation | 12735 |
42 |
| Qorvo US, Inc. | 2018 |
42 |
| Other owners | 3199 |